| PART |
Description |
Maker |
| SI91871DMP-12-T1 SI91871DMP-50-T1 SI91871 SI91871D |
HEATSINK,PLG-IN,MODEL#574902,T 300 - mA的超低噪声LDO稳压器排放的选项
HEATSINK TO220 VER MNT W/TAB.69,1 300 - mA的超低噪声LDO稳压器排放的选项
Heat Sink; Package/Case:TO-220; Thermal Resistance:16.8 C/W; Mounting Type:Screw Mount; Length:11.18mm; Height:11.18mm; Width:28.45mm; Color:Black; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
HEATSINK TO220 VER MNT W/TAB.75,1
HEATSINK TO220 VER MNT W/TAB.75,3
HEATSINK TO-220 VERT MNT .75,1
HEATSINK TO220 HOR MNT W/TAB.75,1
Heat Sink; Package/Case:TO-220; Thermal Resistance:16 C/W; Mounting Type:Through Hole; Length:9.02mm; Height:34.93mm; Width:21.84mm; Body Material:Aluminum; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
HEATSINK TO220 VER MNT W/TAB.69,3
HEATSINK TO-220 VERT MNT W/TAB
300-mA Ultra Low-Noise LDO Regulator With Discharge Option
|
Vishay Intertechnology, Inc.
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| SM6J45A SM6G45 SM6G45A SM6J45 |
BI .DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE AC POWER CONTROL APPLICATIONS
TOSHIBA BI-DIRECTIONAL TRIODE THYRISTOR SILICON PLANAR TYPE
TO-220 .75H .57W .5D W/MTG TAB
Heat Sink; Package/Case:TO-220; Body Material:Aluminum; Thermal Resistance:27.3 C/W; Color:Black; Leaded Process Compatible:No; Mounting Type:Through Hole; Peak Reflow Compatible (260 C):No; Size/Dimensions:0.750H x 0.500W"
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
|
| CYM6001K-25 |
32-BIT, 25 MHz, MICROPROCESSOR, XMA 5.780 X 3.300 INCH, HEAT SINK, SURFACE MOUNT PACKAGE
|
Cypress Semiconductor, Corp.
|
| SGB06N60 SGD06N60 SGP06N60 Q67040-S4450 SGU06N60 Q |
Heat Sink; Package/Case:TO-220; Thermal Resistance:13.4 C/W; Mounting Type:Through Hole; Length:25.4mm; Height:12.7mm; Width:34.92mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
Fast IGBT in NPT-technology
IGBTs & DuoPacks - 6A 600V TO263AB SMD IGBT
IGBTs & DuoPacks - 6A 600V TO252AA SMD IGBT
IGBTs & DuoPacks - 6A 600V TO220AB IGBT
|
INFINEON[Infineon Technologies AG]
|
| ST92F120V1Q7 ST92F120R1Q6 ST92F120JR1Q6 ST92F120JR |
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
8/16-BIT FLASH MCU FAMILY WITH RAM, EEPROM AND J1850 BLPD
HEATSINK TO-220 VERT MNT W/TABS 16位产品系列闪存微控制器与RAM，EEPROM和J1850 BLPD
Heat Sink; Package/Case:TO-218, TO-247; Thermal Resistance:5 C/W; Mounting Type:Screw Mount; Length:38.1mm; Height:38.1mm; Width:41.91mm; Body Material:Aluminum; Body Plating:Anodized; Color:Black; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
ST Microelectronics
STMicroelectronics N.V.
意法半导
|
| ATS-19G-121-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-03-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| 1489948-2 |
HEAT SINK CLIP XFP
|
Tyco Electronics
|
| ATS-312-EXL-R0 |
HEAT SINK THERMAL RESISTANCE
|
Advanced Thermal Solutions, Inc.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| LPD60-7B LPD60-30B LPD60-10B LPD60-8B LPD60-20B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
| LPD45-25B LPD45-30B LPD45-10B LPD45-9B LPD45-6B LP |
Low Pressure Drop Heat Sink
|
ALPHA
|
